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Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible

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Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible

Name: Specific Gravity 22 GCc Thermal Gap Pad Silicone Soft Compressible
Brand: ZIITEK
Price: 1 USD

China Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible wholesale

Brand Name : ZIITEK

Model Number : TIF160-10UF

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Feature : RoHS compliant

keyword : Thermal Gap Pad

Application : Monitoring the Power Box

name : Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU

Specific gravity : 2.2 g/cc

color : gray

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Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU

The TIF160-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-10UF Datasheet-REV02.pdf

Features

> Good thermal conductive: 1.5 W/mK

>Thickness: 1.5mmT

>hardness:75 shore 00

>Colour: gray

>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications

Applications

>LED Power Supply

>LED Controller

>LED Ceilinglamp

>Monitoring the Power Box

>AD-DC Power Adapters

>Rainproof LED Power

Typical Properties of TIF160-10UF Series
Color	gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	2.2 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	1.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	75 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	3.9 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.5 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible

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Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible

Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible

rohs compliant thermal gap pad

compressible thermal gap pad

2.2 g/cc thermal interface pad

Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible Images